HP 200 G3 Petunjuk Pembongkaran Akhir Masa Pakai Produk - Halaman 2
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Halaman Cetak
Tool Description
Screwdiver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Removed Hinge Cap
2.
Removed Base Stand
3.
Removed Front Benzel
4.
Remove LCD display
5.
Removed HDD holder and HDD
6.
Removed ODD
7.
Removed Speaker
8.
Removed Power PCB
9.
Remove FAN
10. Removed Carmera module
11. Removed Heat Sink
12. Removed VGA PCB, Wirelan Card, SSD Card, RAM
13. Removed Motherboard,
14. Removed Hinge
15. Removed MB Holder
16. Removed Rear Cover
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed Hinge Cap
2. Removed Base Stand
Tool Size (if
applicable)
TORX T8