Yamaha HS50M Manuale di servizio - Pagina 12

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HS80M/HS50M

4-3

Unsolder soldered parts (22 locations) on the pat-

tern side of IC801 and IC802. (Photo. 1)

4-4

Remove the two (2) screws marked [A] and remove

the heat sink with IC801 and IC802. (Photo. 1)

Remove the two (2) screws marked [B] and remove

IC801 and IC802. (Photo. 1)

4-5

Remove the four (4) screws marked [C], remove the

AMP mounting bracket. The AMP circuit board can

then be removed. (Photo. 1)

PLATE

IC801

AMP mounting BRACKET

AMP

[B]

[C]

Photo. 1

INPUT Circuit Board

(Time required: about 3 minutes)

5-1

Remove the rear panel assembly. (See procedure 3.)

5-2

Remove the four (4) screws marked [110] and the

screw marked [115]. (Fig. 3)

5-3

Remove the LEVEL knob, the hexagonal nut [E] and

washer [D]. (Fig. 3, Photo. 5)

5-4

Remove the hexagonal nut [F] on the phone type in-

put connector. The INPUT assembly can then be re-

moved. (Photo. 5)

5-5

Remove the three (3) screws marked [G] and remove

the case PWB. (Photo. 3)

The Input circuit board can then be removed.

The case PWB is not a component of the INPUT cir-

cuit board. When replacing the INPUT circuit board,

remove the case PWB and reuse it.

HEAT SINK

[A]

AMP mounting BRACKET

IC802

AMP

AMP Circuit Board

AMP

CASE PWB

[C]

[G]

Photo. 3

HS50M

INPUT Circuit Board

INPUT

Photo. 2