Toshiba 15V11F Manual de serviço - Página 10

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REMOVAL AND INSTALLATION OF

FLAT PACKAGE IC

REMOVAL

Put the Masking Tape (cotton tape) around the Flat

Package IC to protect other parts from any damage.

(Refer to Fig. 2-1.)

NOTE

Masking is carried out on all the parts located within

10 mm distance from IC leads.

Masking Tape

(Cotton Tape)

Heat the IC leads using a blower type IC desoldering

machine. (Refer to Fig. 2-2.)

NOTE

Do not add the rotating and the back and forth

directions force on the IC, until IC can move back and

forth easily after desoldering the IC leads completely.

DISASSEMBLY INSTRUCTIONS

Fig. 2-1

Blower type IC

desoldering machine

Fig. 2-2

B2-1

When IC starts moving back and forth easily after

desoldering completely, pickup the corner of the IC using

a tweezers and remove the IC by moving with the IC

desoldering machine. (Refer to Fig. 2-3.)

NOTE

Some ICs on the PCB are affixed with glue, so be

careful not to break or damage the foil of each IC

leads or solder lands under the IC when removing it.

Tweezers

Peel off the Masking Tape.

Absorb the solder left on the pattern using the Braided

Shield Wire. (Refer to Fig. 2-4.)

NOTE

Do not move the Braided Shield Wire in the vertical

direction towards the IC pattern.

Braided Shield Wire

Blower type IC

desoldering

machine

Fig. 2-3

Soldering Iron

Fig. 2-4

IC pattern