HP R8P13A Anweisungen für die Demontage - Seite 2

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Item Description

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Torx Screwdriver

Phillips Screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

Unscrew 7x T10 screws for top cover

Slide top cover backward from the faceplate to open the cover

Unscrew 17x screws securing Main PCBA and Console PCBA

Unscrew 2x screws securing Trident3 heatsink

Remove Console PCBA from motherboard

Slide PCBA away from faceplate and lift back of PCBA to disassemble from chassis

Disassemble all plastic baffles from PCBA

Disassemble all heatsinks from motherboard

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1: System PCA

Attachment 2: Location of Coincell.

MF877-00

Template Revision C, 30-July-2018

HPE instructions for this template are available at

Notes

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Tool Size (if

applicable)

T10

MF877-01

Quantity

of items

included

in product

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