EPC EPC9041 Schnellstart-Handbuch - Seite 3

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THERMAL CONSIDERATIONS

The EPC9041 development boards showcase the EPC2105 eGaNIC.
These development boards are intended for bench evaluation
with low ambient temperature and convection cooling. The addition
Table 3: Bill of Materials - Amplifier Board
Item
Qty
Reference
1
3
C4, C10, C11,
2
2
C16, C17
3
2
C9, C19
4
4
C21, C22, C23, C24
5
2
D1, D2
6
3
J1, J2, J9
7
6
J3, J4, J5, J6, J7, J8
8
1
Q1
9
1
R1
10
2
R2, R15
11
2
R4, R5
12
4
R19, R20, R23, R24
13
2
TP1, TP2
14
1
TP3
15
1
U1
16
1
U2
17
1
U3
18
1
U4
19
0
R14
20
0
D3
21
0
P1, P2
EPC – EFFICIENT POWER CONVERSION CORPORATION |
EPC9041 DEVELOPMENTBOARD
Figure 3: Proper Measurement of Switch Node – OUT
Part Description
Capacitor, 1 µF, 10%, 25 V, X5R
Capacitor, 100 pF, 5%, 50 V, NP0
Capacitor, 0.1 µF, 10%, 25 V, X5R
Capacitor, 4.7 µF, 10%, 100 V, X7S
Schottky Diode, 30 V
Connector
Connector
eGaNIC
Resistor, 10.0 k, 5%, 1/8 W
Resistor, 0 Ω, 1/8W
Resistor, 47 Ω, 1%, 1/8W
Resistor, 0 Ω, 1/20W
Test Point
Connector
I.C., Logic
I.C., Gate driver
I.C., Regulator
I.C., Logic
Optional Resistor
Optional Diode
Optional Potentiometer
WWW.EPC-CO.COM
Do not use probe ground lead
Ground probe
against TP3
Minimize loop
of heat-sinking and forced air cooling can significantly increase the
current rating of these devices, but care must be taken to not exceed
the absolute maximum die temperature of 150°C.
NOTE. These development boards do not have any current or thermal protection on
board.
Manufacturer
Murata, GRM188R61E105KA12D
Kemet, C0402C101K5GACTU
TDK, C1005X5R1E104K
TDK, CGA4J3X7S2A105K125AE
Diodes Inc., SDM03U40-7
2 pins of Tyco, 4-103185-0
FCI, 68602-224HLF
EPC2105
Stackpole, RMCF0603FT10K0
Stackpole, RMCF0603ZT0R00
Stackpole, RMCF0603FT47R0
Panasonic, ERJ-1GE0R00C
Keystone Elect, 5015
1/40th of Tyco, 4-103185-0
Fairchild, NC7SZ00L6X
Texas Instruments, LM5113
Microchip, MCP1703T-5002E/MC
Fairchild, NC7SZ08L6X
| COPYRIGHT 2017 |
Demonstration System EPC9041
Place probe tip
in large via at OUT
| 3