Motorola GM100 Service-Handbuch - Seite 19

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General Repair Procedures and Techniques

Chip Components

Use either the RLN4062 Hot-Air Repair Station or the Motorola 0180381B45 Repair Station for

chip component replacement. When using the 0180381B45 Repair Station, select the TJ-65 mini-

thermojet hand piece. On either unit, adjust the temperature control to 370 °C (700 °F), and

adjust the airﬂow to a minimum setting. Airﬂow can vary due to component density.

To remove a chip component:

Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm

(1/8") above the component to be removed.

Begin applying the hot air. Once the solder reﬂows, remove the component using a pair

of tweezers.

Using a solder wick and a soldering iron or a power desoldering station, remove the

excess solder from the pads.

To replace a chip component using a soldering iron:

Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the

solder pads.

Using a pair of tweezers, position the new chip component in place while heating the

fresh solder.

Once solder wicks onto the new component, remove the heat from the solder.

Heat the remaining pad with the soldering iron and apply solder until it wicks to the

component. If necessary, touch up the ﬁrst side. All solder joints should be smooth and

shiny.

To replace a chip component using hot air:

Use the hot-air hand piece and reﬂow the solder on the solder pads to smooth it.

Apply a drop of solder paste ﬂux to each pad.

Using a pair of tweezers, position the new component in place.

Position the hot-air hand piece approximately 0.3 cm (1/8" ) above the component and

begin applying heat.

Once the solder wicks to the component, remove the heat and inspect the repair. All

joints should be smooth and shiny.

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