ESD Precautions
Some semiconductor devices are easily damaged from static electricity.
These components are Electrostatically Sensitive Devices (ESDs); examples
include integrated circuits (ICs), Large-Scale Integrated circuits (LSIs), some
field-effect transistors and semiconductor chip components. The following
techniques reduce the occurrence of component damage caused by static
electricity:
CAUTION:
Be sure the power is Off to the chassis or circuit board, and
observe all other safety precautions.
Immediately before handling any semiconductor components assemblies,
drain the electrostatic charge from your body by touching a known earth
ground. Alternatively, wear a discharging wrist strap device. (Be sure to
remove the strap before applying power to the unit under test to avoid
potential shock.)
After removing an ESD-equipped assembly, place it on a conductive
surface such as aluminum foil or the static bag to prevent accumulation of
an electrostatic charge.
Do not use freon-propelled chemicals. These can generate electrical
charges sufficient to damage ESDs.
Do not remove a replacement ESD from its protective package until you
are ready to install it. Most replacement ESDs are packaged with leads
that are electrically shorted together by conductive foam, aluminum foil or
other conductive materials.
Immediately before removing the protective material from the leads of a
replacement ESD, touch the protective material to the chassis or circuit
assembly into which the device is to be installed.
Minimize body motions when handling unpackaged replacement ESDs.
Motion such as your clothes brushing together, or lifting a foot from a
carpeted floor can generate enough static electricity to damage an ESD.
Handle ICs and EPROMs carefully to avoid bending a pin.
Pay attention to the direction of parts when mounting or inserting them on
a PCB.
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