Cypress Semiconductor CY62167EV30 Spezifikationsblatt - Seite 2

Blättern Sie online oder laden Sie pdf Spezifikationsblatt für Computer Hardware Cypress Semiconductor CY62167EV30 herunter. Cypress Semiconductor CY62167EV30 15 Seiten. Mobl 16-mbit (1m x 16 / 2m x 8) static ram

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Pin Configuration

Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View

Product Portfolio

Product
Range
CY62167EV30LL
Industrial/Auto-A
Notes
1. The information related to 6 x 7 x 1 mm VFBGA package is preliminary.
2. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.
3. NC pins are not connected on the die.
4. The BYTE pin in the 48-TSOPI package has to be tied to V
by tying the BYTE signal to V
. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and IO
SS
5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
Document #: 38-05446 Rev. *E
1
2
A
OE
BLE
A
I/O
BHE
8
A
I/O
I/O
9
10
V
I/O
A
SS
11
NC
V
I/O
CC
12
A
I/O
I/O
13
14
A
I/O
A
15
19
A
A
A
8
18
Figure 2. 48-Pin TSOP I Top View
A15
1
A14
2
A13
3
A12
4
A11
5
A10
6
A9
7
A8
8
A19
9
NC
10
WE
11
CE
12
2
NC
13
BHE
14
BLE
15
A18
16
A17
17
A7
18
A6
19
A5
20
A4
21
A3
22
A2
23
A1
24
V
Range (V)
CC
[5]
Min
Typ
2.2
3.0
to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM
CC
4
5
3
6
A
A
CE
A
0
1
2
2
A
CE
I/O
B
3
4
0
1
A
C
I/O
I/O
5
6
1
2
V
A
I/O
D
CC
7
17
3
Vss
A
I/O
E
16
4
F
A
I/O
I/O
14
15
5
6
A
G
WE
I/O
13
12
7
A
A
NC
H
9
10
11
[3, 4]
Speed
Operating I
(ns)
f = 1 MHz
[5]
Max
Typ
Max
3.6
45
2.2
4.0
to IO
pins are not used.
8
14
CY62167EV30 MoBL
[1, 2, 3]
48
A16
47
BYTE
46
Vss
45
IO15/A20
44
IO7
43
IO14
42
IO6
41
IO13
40
IO5
39
IO12
38
IO4
37
Vcc
36
IO11
35
IO3
34
IO10
33
IO2
32
IO9
31
IO1
30
IO8
29
IO0
28
OE
27
Vss
26
CE
1
25
A0

Power Dissipation

(mA)
CC
Standby I
f = f
max
[5]
[5]
Typ
Max
Typ
25
30
1.5
= V
(typ), T
= 25°C.
CC
CC
A
Page 2 of 14
®
SB2
(μA)
Max
12
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