Cypress Semiconductor STK11C88 Spezifikationsblatt - Seite 13
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Package Diagrams
14
15
0.697[17.70]
0.713[18.11]
0.013[0.33]
0.050[1.27]
0.019[0.48]
TYP.
Document Number: 001-50591 Rev. **
Figure 11. 28-Pin (300 mil) SOIC (51-85026)
NOTE :
PIN 1 ID
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
1
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
0.291[7.39]
4. PACKAGE WEIGHT 0.85gms
0.300[7.62]
*
0.394[10.01]
0.419[10.64]
28
0.026[0.66]
0.032[0.81]
SEATING PLANE
0.092[2.33]
0.105[2.67]
0.004[0.10]
*
0.004[0.10]
0.0118[0.30]
MIN.
MAX.
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
0.015[0.38]
0.050[1.27]
51-85026-*D
51 85127 *A
STK11C88
*
0.0091[0.23]
0.0125[3.17]
Page 13 of 15
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