Dusun DSM-05D-IPEX Manual del usuario - Página 10

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Zhejiang Dusun Electron Co., Ltd

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Alarm temperature: 130℃

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SMT placement ready temperature after natural cooling: < 36℃

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Number of drying times: 1

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Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have been unpacked for over three

months.

Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads

are exposed to the air for over three months, they will be oxidized severely and

dry joints or solder skips may occur. Dusun is not liable for such problems and

consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection

and AOI before first SMT placement to determine a proper oven temperature

and component placement method. Draw 5 to 10 modules every hour from

subsequent batches for visual inspection and AOI.

6.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve.

The highest temperature is 245℃.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most

twice.

Zhejiang Dusun Electron Co., Ltd

Tel: 86-571-86769027/8 8810480

Website: www.dusuniot.

Floor 8, Building A, Wantong Center

www.dusunremotes.com

Hangzhou, China