Hi-Link HLK-RM08S Manual del usuario - Página 12

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Notes：

1，All pins default 1

2，IO drive current is 4mA

3，All TTL is 3.3V

5. Dimensions

Introductions：

1，The size of the module is length 1mm,width 1mm,space 1.4mm , depth 1.8mm.

2，The thickness of the module is 1.8mm.

3, The noted numbers in the picture is the actual size of module,do recommended pad extension around

1mm, internal heat shrink 0.2mm pad, internal thermal pad grounding once do encapsulation.

Do when the package recommended pad extension around the 1mm, 3 internal heat shrink 0.2mm pad,

internal thermal pad grounding.

HLK-RM08S

HLK-RM08S Drawing