Gan Systems GS65011-EVBEZ Manual del usuario - Página 16
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Thermal Considerations
The EVB includes one GS-065-011-1-L GaN E-HEMT. Although the electrical
performance surpasses that for traditional silicon devices, their relatively smaller size
does magnify the thermal management requirements. The evaluation board is intended
for bench evaluation under low ambient temperature and with convection cooling. The
addition of heat-sinking and forced air cooling can significantly increase the current
rating of these devices, but care must be taken to not exceed the absolute maximum
junction temperature of +150 °C.
Note: The EVB does not include any on-board current or thermal protection.
The thermal performance of the EVB is shown in
thermography was performed under the following conditions, with a fan on at room-
ambient temperature:
• V
= 200V
IN
• V
= 400V
OUT
• I
= 0.5A
OUT
• f
= 250 KHz
SW
Thermal imaging with an external fan (T
Figure 11 •
GSWPT-EVBEZ Rev190621
EZDrive
© 2019 GaN Systems Inc.
Please refer to the Evaluation Board/Kit Important Notice on page 15
Open Loop Boost Evaluation Board
TM
Figure 10
and
Figure
11. Infrared
= 44.8˚C)
MAX
www.gansystems.com
GS65011-EVBEZ
User's Guide
16