Chrontel CH7034B Notas de aplicación - Página 11

Navegue en línea o descargue pdf Notas de aplicación para Media Converter Chrontel CH7034B. Chrontel CH7034B 18 páginas. Hdtv/vga/lvds encoder

CHRONTEL

AN-B013

Thermal Via Array

Exposed Pad

(5x5) 1 mm Pitch

6.6 mm

land pattern

0.3 mm diameter

Figure 11: Thermal Land Pattern

When applying solder paste to the thermal land pattern, the recommended stencil thickness is from 5 to 8 mils.

Thermal resistance was calculated using the thermal simulation program called ANSYS.

2.11 QFN Package Assembly

For the assembly process, it is important to limit the amount of solder paste that is put under the thermal pad. If too

much paste is put on the PCB, the package may float during assembly. Compared with the solder mask of thermal

pad, the paste mask should be shrank to70%~80%. Figure 12 shows a paste mask pattern in gray for the thermal

pad.

Figure12: Thermal Pad Paste Mask Pattern

206-1000-013

Rev1.4,

06/30/2020