Cypress Semiconductor MoBL CY62146ESL Hoja de especificaciones - Página 4

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Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
C
Input Capacitance
IN
C
Output Capacitance
OUT

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Θ
Thermal Resistance
JA
(Junction to Ambient)
Θ
Thermal Resistance
JC
(Junction to Case)
AC Test Loads and Waveforms
V
CC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Parameters
R1
R2
R
TH
V
TH
Document #: 001-43142 Rev. **
T
= 25°C, f = 1 MHz,
A
V
= V
CC
CC(typ)
Still Air, soldered on a 3 × 4.5 inch, two-layer
printed circuit board
R1
V
CC
GND
Rise Time = 1 V/ns
R2
Equivalent to:
2.5V
16667
15385
8000
1.20
Test Conditions
Test Conditions
ALL INPUT PULSES
90%
10%
THÉ VENIN EQUIVALENT
R
TH
OUTPUT
3.0V
5.0V
1103
1800
1554
990
645
639
1.75
1.77
CY62146ESL MoBL
Max
Unit
10
10
TSOP II
Unit
°C/W
77
°C/W
13
90%
10%
Fall Time = 1 V/ns
V
TH
Unit
Ω
Ω
Ω
V
Page 4 of 12
®
pF
pF
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