Dell PowerEdge M910 Manuel technique - Page 3
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1
Product Comparison ........................................................................................... 6
1.1
Overview .................................................................................................. 6
1.2
Powerful Performance................................................................................... 6
1.3
Scaling Capability ........................................................................................ 6
1.4
High Reliability ........................................................................................... 6
1.5
Product Comparison ..................................................................................... 7
2
Key Technologies ............................................................................................. 10
2.1
Overview ................................................................................................ 10
2.2
Detailed Information .................................................................................. 10
2.2.1
Intel 7510 Chipset ................................................................................ 10
2.2.2
Intel Processors ................................................................................... 10
2.2.3
FlexMem Bridge .................................................................................. 11
2.2.4
IO Hub (IOH) with Intel QuickPath Architecture ............................................. 11
2.2.5
DDR3 Memory ..................................................................................... 11
2.2.6
PCI Express Generation 2 ....................................................................... 11
2.2.7
Internal Redundant SD Module ................................................................. 11
2.2.8
iDRAC6 Express ................................................................................... 11
3
System Information .......................................................................................... 12
3.1
Overview ................................................................................................ 12
3.2
Product Features Summary ........................................................................... 12
4
Mechanical .................................................................................................... 14
4.1
Overview ................................................................................................ 14
4.2
Module Dimensions and Weight ...................................................................... 14
4.3
Internal Module ......................................................................................... 14
4.4
Security .................................................................................................. 15
4.5
Cover Latch ............................................................................................. 15
4.6
TPM (Trusted Platform Module) ...................................................................... 15
4.7
Power Off Security ..................................................................................... 16
4.8
USB Key .................................................................................................. 16
4.9
Battery ................................................................................................... 16
4.10
Field Replaceable Units (FRU)........................................................................ 16
5
Power, Thermal, and Acoustic ............................................................................. 17
5.1
Overview ................................................................................................ 17
5.2
Acoustics ................................................................................................ 18
5.3
Thermal.................................................................................................. 19
5.4
Power Efficiency ....................................................................................... 19
6
Processors ..................................................................................................... 20
6.1
Overview ................................................................................................ 20
6.2
Features ................................................................................................. 20
6.3
Supported Processors .................................................................................. 21
6.4
Processor Configurations .............................................................................. 22
6.5
FlexMem Bridge ........................................................................................ 22
7
Memory ........................................................................................................ 24
7.1
Overview ................................................................................................ 24
7.2
DIMMs Supported ....................................................................................... 24
7.3
DIMM Slots ............................................................................................... 24
7.4
Intel 7500 Scalable Memory Buffer (SMB) ........................................................... 24
7.5
Memory RAS Support ................................................................................... 25
7.5.1
Sparing ............................................................................................. 25
7.5.2
Mirroring ........................................................................................... 25
PowerEdge M910 Technical Guide
Table of Contents
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