HP Xw460c - ProLiant - Blade Workstation Vue d'ensemble - Page 31

Parcourez en ligne ou téléchargez le pdf Vue d'ensemble pour {nom_de_la_catégorie} HP Xw460c - ProLiant - Blade Workstation. HP Xw460c - ProLiant - Blade Workstation 35 pages. Mezzanine card installation instructions for supported hp proliant c-class bladesystem servers
Également pour HP Xw460c - ProLiant - Blade Workstation : Manuel de mise en œuvre (35 pages), Manuel de prévention des erreurs (12 pages), Livre blanc technique (12 pages), Mise à jour du micrologiciel (9 pages), Manuel d'installation (2 pages), Manuel des questions fréquemment posées (14 pages), Poster d'installation (9 pages), Manuel d'installation (33 pages), Manuel de gestion (28 pages), Manuel du matériel (23 pages), Manuel de l'utilisateur (33 pages), Manuel d'optimisation (13 pages), Garantie limitée (10 pages), Manuel d'instructions d'installation (10 pages), Manuel d'instructions d'installation (8 pages), Instructions d'installation (4 pages), Instructions d'installation (2 pages)

HP BladeSystem Power Sizer

The HP BladeSystem Power Sizer is a tool that assists facilities teams and IT staff in sizing their power

and cooling infrastructures to meet the needs of an HP BladeSystem solution. The BladeSystem Power

Sizer is based on actual component-level power measurements of a system stressed to maximum

capability. It allows a customer to select the type and number of components within each server blade

and enclosure and to see the effect of changes on power consumption and heat loading.

Values obtained from the BladeSystem Power Sizer tool are based on heavy enterprise application

loads and are intended as guidelines only. Actual measured power consumption may be significantly

lower or higher than the numbers provided by the Power Sizer. Power consumption will vary with

application type, application utilization, and ambient temperature. The BladeSystem Power Sizer is

available at this website:

http://www.hp.com/go/bladesystem/powercalculator

The HP BladeSystem c7000 Enclosure is the foundation of a modular computing architecture that

consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more

effectively. Thermal Logic technologies provide the mechanical design features, built-in monitoring,

and control capabilities that enable IT administrators to optimize their power and thermal

environments. The shared, high-speed, NonStop midplane and pooled-power backplane in the

enclosure accommodate new bandwidths and new technologies. The BladeSystem Onboard

Administrator supplies the infrastructure to provide essential power and cooling information and help

to automate infrastructure management. The HP BladeSystem c7000 Enclosure provides all the power,

cooling, and I/O infrastructure to support c-Class modular servers, interconnects, and storage

components, today and for the next several years.