Toshiba TLP711E Manuel d'entretien - Page 19

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1. PART CONFIGURATION AND THEIR SYMBOLS

1-1. Replacing Subminiature "CHIP" Parts

1-1-1. Required Tools:

1. Fine tipped, well insulated soldering "pencil", about

30 Watts.

2. Tweezers.

3. Blower type hair dryer.

1-1-2. Soldering Cautions:

1. Do not apply heat for more than 3s.

2. Avoid using a rubbing stroke when soldering.

3. Discard removed chips; do no reuse them.

4. Supplementary cementing is not required.

5. Use care not to scratch or otherwise damage the chips.

1-1-3. Removal (Resistors, Capacitors, etc.):

1. Melt the solder at one side.

Fig. 2-1-1

2. Grasp the part with tweezers and melt the solder at the

other side.

TWEEZERS

Fig. 2-1-2

3. Remove the part with a twisting motion.

Fig. 2-1-3

SECTION 2

SERVICING DIAGRAMS

1-1-4. Removal (Transistors, Diodes, etc.):

1. Melt the solder of one lead.

2. Lift the side of that lead upward.

3. Simultaneously heat solder the two remaining leads

and lift part to remove.

1-1-5. Preheating (Except for semiconductors):

Immediately before installing new resistors or capacitors,

use a blower type hair dryer and preheat the part for about

two min. at approximately 150°C.

1-1-6. Replacement:

1. Presolder the contact points of the circuit pattern.

2. Press the part downward with tweezers and apply the

soldering pencil as indicated in the figure.

TWEEZERS

2-1

TWEEZERS

Fig. 2-1-4

Fig. 2-1-5

Fig. 2-1-6

Fig. 2-1-7

Fig. 2-1-8