Avnet MSC Technologies ETE-A945GSE Petunjuk Pemasangan - Halaman 2
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Halaman CetakMSC ETE-A945
1 Introduction
This document is designed to give the customer a better understanding of what needs to be considered
when using MSC heatspreaders on the ETE-A945GSE module. Below you will find important guidelines
that must be followed to ensure that the heatspreader is properly mounted.
1.1
General Information
Modern computers use very dense chip architectures that create a lot of heat in a relatively small area. To
make sure that the parts are used within their specifications, it is necessary to provide a method to
conduct the thermal energy away from the sensitive semiconductor dies. For this purpose MSC offers
different cooling solutions.
1.2
The Difference between a Heat Sink and a Heat Spreader
A heat sink is capable to remove the heat that emerges by the electrical power that is used to operate a
computer. This is usually done by dissipating the heat to the environment.
A heat spreader is just a means to lead the heat to the heat sink, which finally dissipates it. A heat
spreader is not a heat sink!
2 Mounting Instructions
Photo 1 shows the heat spreader as delivered.
The three frames show the thermal contact locations of the heat spreader. According to the amount of
heat that has to be transferred, different materials have been chosen to achieve optimal thermal contact.
The grey pads consist of a phase change material, which melts the first time it is heated. Due to the
mechanical pressure between die and heat sink, the residual material is pressed out of the gap; thus
leaving behind only a very thin film with a very good thermal performance. Since these pads are printed
on the aluminum, they are very soft and sensitive to scratches. If you happen to damage the surface of
the pad, use a clean knife or something similar and try to form it so that the die surfaces are
completely covered.
The white material is a standard heat-conductive paste.
Photo 1
Heat Spreader Mounting Instructions
Rev. 1.1
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