HP 406 Microtower Business Petunjuk Pembongkaran Akhir Masa Pakai Produk - Halaman 2

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Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1crisscross screw driver
Description #2 hexagon screw driver
Description #3 electric iron
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove access panel from the unit.
2.
Remove front panel from the unit.
3.
Remove all the cable from the unit.
4.
Remove HDD from the unit.
5.
Remove ODD from the unit.
6.
Take off PSU from the unit.
7.
Take off the system fan from the unit.
8.
Take off Card Reader from the unit.
9. Take off FIO from the unit.
10. Take off Memory from the unit.
11. Take off CPU cooler from the unit.
12. Take off PCA from the unit.
13. Take off battery from the unit.
14. Open the PSU.
15. Take off PSU fan.
16. Take off PCA from the PSU.
17. Take off CAP using electric iron.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
0
Tool Size (if
applicable)
2#
T15
QUICK 310
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