HP 5500-24G-SFP EI TAA Petunjuk Pembongkaran Akhir Masa Pakai Produk - Halaman 2
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Halaman Cetak
Tool Description
Screw driver
Tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack.
2.
Remove all of the labels.
3.
Unscrew the screws on filler panel 2 and 3, and then remove them.
4.
Unscrew the screws on top cover 4, and then remove it.
5.
Unscrew the screws on PCB-assembly 5, and then remove the assembly.
6.
Remove the light pipes 6,7,8,9 on the PCB-assembly 5.
7. Unscrew the screws on fans 10 and 11, remove them from chassis assembly 13.
8.
Remove the front panel assembly 12 from chassis assembly 13.
9.
Remove shielding fingers 3.1 from filler panel 3.
10. Unscrew the screws on part 5.1, remove it from PCB-assembly 5.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 Remove mounting angle
EL-MF877-00
Template Revision B
Figure 2 Rear of HP 5500-24G-SFP HI Switch
Tool Size (if
applicable)
2#
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