akrometrix DIC Panduan Pengguna - Halaman 4

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1.1

The DIC system is an add-on module to complement the Akrometrix TherMoiré AXP

or Studio PS400. It is designed for measuring both in-plane and out-of-plane

displacements of samples as a function of temperature. The module uses a full-field,

non-contact optical technique called digital image correlation (DIC). Samples are

measured inside a computer-controlled oven chamber with a temperature range from

ambient to 300°C.

This manual describes the system hardware, image acquisition software (DIC), and

data analysis software (Vic-3D). The DIC software is specific to the AXP and requires its

system hardware to operate. The Vic-3D software may reside on the AXP computer or

operate as a stand-alone application on a remote computer.

Before operating the system, the user should carefully read Section 1.2, which

describes safety and health hazards associated with the system. The TherMoiré AXP or

Studio PS400 system contains a high temperature oven, motorized sample stages, and

electrical systems, all with the potential to injure if used or maintained improperly.

Section 1.3 identifies system components and controls. Section 2 describes basic

procedures for system setup and shutdown.

Appendix A describes the DIC system assembly, individual components and

optical alignment of those components. It has recommended procedures for

maintenance, storage, and transport of the DIC system. This section also contains

equipment ratings, technical support material, and a description of software file types.

1.2

1.2.1 Health and Safety Hazards

 The DIC module is designed to work with the AXP or Studio PS400 system. Do

not operate the DIC system separately. Doing so can cause potential damage of

the DIC components.

 When installing or removing the DIC assembly, place the Akrometrix-supplied

oven shield on top of the oven glass lid to protect the glass from any object that

could be dropped from the DIC assembly.

 Always keep the six bolts on the triangle supports while installing or removing the

DIC assembly.

 During installation or removal of the DIC unit, the user is required to lean inside

the AXP or Studio PS400. Overhead obstacles such as the light source can

cause slight head injury. During installation, be careful and aware of any

overhead obstacles.

 Turn off both light sources prior to disconnecting the optical fiber bundle.

Operation with the light on may cause severe discomfort due to the operator

being exposed to a very bright light with the optical fiber bundle disconnected.

Page 4 of 19

1 Introduction

40-5000-01500 Rev. A

DIC User Manual