Cypress Semiconductor CY7C1303BV25 Lembar Spesifikasi - Halaman 18

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Cypress Semiconductor CY7C1303BV25 Lembar Spesifikasi

Ordering Information

"Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
Speed
(MHz)
Ordering Code
167
CY7C1303BV25-167BZC
CY7C1306BV25-167BZC
CY7C1303BV25-167BZXC
CY7C1306BV25-167BZXC
CY7C1303BV25-167BZI
CY7C1306BV25-167BZI
CY7C1303BV25-167BZXI
CY7C1306BV25-167BZXI

Package Diagram

PIN 1 CORNER
PIN 1 CORNER
1
2
3
4
1
2
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
A
A
B
13.00±0.10
B
SEATING PLANE
C
SEATING PLANE
C
Quad Data Rate™ SRAM and QDR™ SRAM comprise a new family of products developed by Cypress, IDT, NEC, Renesas and
Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05627 Rev. *A
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
visit
www.cypress.com
Package
Diagram
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)
TOP VIEW
TOP VIEW
5
6
7
8
9
10
11
3
4
5
6
7
8
9
10
11
13.00±0.10
for actual products offered".
Package Type
BOTTOM VIEW
11
10
9
8
11
10
9
A
5.00
A
5.00
B
13.00±0.10
B
0.15(4X)
0.15(4X)
NOTES :
NOTES :
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
CY7C1303BV25
CY7C1306BV25
Operating
Range
Commercial
Industrial
PIN 1 CORNER
BOTTOM VIEW
PIN 1 CORNER
Ø0.05 M C
Ø0.05 M C
Ø0.25 M C A B
Ø0.25 M C A B
-0.06
Ø0.50 (165X)
+0.14
-
0.06
Ø0.50
(165X)
7
6
5
4
3
2
1
+0.14
8
7
6
5
4
3
2
1
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
1.00
1.00
10.00
10.00
13.00±0.10
51-85180-*A
51-85180-*A
Page 18 of 19
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