Cypress Semiconductor CY7C1353G Lembar Spesifikasi - Halaman 3

Jelajahi secara online atau unduh pdf Lembar Spesifikasi untuk Perangkat Keras Komputer Cypress Semiconductor CY7C1353G. Cypress Semiconductor CY7C1353G 14 halaman. Cypress 4-mbit (256k x 18) flow-through sram with nobl architecture specification sheet

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Pin Definitions

Name
IO
A
, A
, A
Input-
0
1
Synchronous
BW
Input-
[A:B]
Synchronous
WE
Input-
Synchronous
ADV/LD
Input-
Synchronous
CLK
Input-Clock
CE
Input-
1
Synchronous
CE
Input-
2
Synchronous
CE
Input-
3
Synchronous
OE
Input-
Asynchronous
CEN
Input-
Synchronous
ZZ
Input-
Asynchronous
DQ
IO-
s
Synchronous
DQP
IO-
[A:B]
Synchronous
MODE
Input
Strap Pin
V
Power Supply Power supply inputs to the core of the device.
DD
V
IO Power
DDQ
Supply
V
Ground
SS
NC,NC/9M,
–
NC/18M,
NC/36M
NC/72M,
NC/144M,
NC/288M,
Document #: 38-05515 Rev. *E
Address Inputs used to select one of the 256K address locations. Sampled at the rising edge
of the CLK. A
are fed to the two-bit burst counter.
[1:0]
Byte Write Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on
the rising edge of CLK.
Write Enable Input, Active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This
signal must be asserted LOW to initiate a write sequence.
Advance/Load Input. Used to advance the on-chip address counter or load a new address. When
HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new
address can be loaded into the device for an access. After being deselected, ADV/LD must be
driven LOW to load a new address.
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK
is only recognized if CEN is active LOW.
Chip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
, and CE
to select/deselect the device.
2
3
Chip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE
and CE
to select/deselect the device.
1
3
Chip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
and CE
to select/deselect the device.
1
2
Output Enable, asynchronous input, Active LOW. Combined with the synchronous logic block
inside the device to control the direction of the IO pins. When LOW, the IO pins are allowed to
behave as outputs. When deasserted HIGH, IO pins are tri-stated, and act as input data pins. OE
is masked during the data portion of a write sequence, during the first clock when emerging from
a deselected state, when the device has been deselected.
Clock Enable Input, Active LOW. When asserted LOW the Clock signal is recognized by the
SRAM. When deasserted HIGH the Clock signal is masked. While deasserting CEN does not
deselect the device, CEN can be used to extend the previous cycle when required.
ZZ "sleep" Input. This active HIGH input places the device in a non-time critical "sleep" condition
with data integrity preserved. During normal operation, this pin has to be low or left floating. ZZ pin
has an internal pull down.
Bidirectional Data IO Lines. As inputs, they feed into an on-chip data register that is triggered by
the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by address during the clock rise of the read cycle. The direction of the pins is controlled by OE and
the internal control logic. When OE is asserted LOW, the pins can behave as outputs. When HIGH,
DQ
and DQP
are placed in a tri-state condition. The outputs are automatically tri-stated during
s
[A:B]
the data portion of a write sequence, during the first clock when emerging from a deselected state,
and when the device is deselected, regardless of the state of OE.
Bidirectional Data Parity IO Lines. Functionally, these signals are identical to DQ
sequences, DQP
is controlled by BW
[A:B]
MODE Input. Selects the burst order of the device.
When tied to Gnd selects linear burst sequence. When tied to V
burst sequence.
Power supply for the IO circuitry.
Ground for the device.
No Connects. Not internally connected to the die. NC/9M, NC/18M, NC/72M, NC/144M, NC/288M,
are address expansion pins are not internally connected to the die.
Description
correspondingly.
x
or left floating selects interleaved
DD
CY7C1353G
. During write
s
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