Canon EOS 1D Mark III White Paper - Pagina 16

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New UDMA Compatibility

EOS Integrated Cleaning

System

UDMA (Ultra Direct Memory Access) is a new specification for CF cards (Compact Flash

Specification Revision 4.0) to enable high-speed writing to the card. With a UDMA-com-

pliant CF card, the data transfer speed is twice as fast as with the EOS-1D Mark III, and

the writing speed is on par with the EOS-1D Mark III (and about 3 times as fast as the

EOS-1Ds Mark II) even though the pixel count is twice as large.

With a higher number of pixels in the same sensor dimensions, the pixel size is neces-

sarily smaller than those of the EOS-1Ds Mark II. Nevertheless, the ISO speed range is

the same as that of the EOS-1Ds Mark II with ISO 100 to 1600 and ISO extensions of 50

(L) and 3200 (H).* The ISO speed Safety Shift is enabled via C.Fn I-8-2. The ISO speed

control value differs from that of the EOS-1D Mark III. Note that the maximum burst dur-

ing continuous shooting will decrease if ISO speed safety shift, noise reduction for high

ISO speeds (C.Fn II -2-1), or a high ISO speed is set. (The maximum burst during contin-

uous shooting is displayed in the viewfinder.)

*Standard output sensitivity. Recommended exposure index.

The EOS-1Ds Mark III uses the EOS Integrated Cleaning System, a complete dust reduc-

tion system for reducing dust adhering to the imaging sensor, removing dust, and mak-

ing dust spots less noticeable. The Self Cleaning Sensor Unit is a newly designed, dedi-

cated unit optimized for the full-frame CMOS sensor. As with the EOS-1D Mark III, this

unit has two thin piezoelectric elements that apply ultrasonic vibration to shake dust off

the infrared absorption glass which is the outermost layer in front of the low-pass filter.

The removed dust then sticks to the absorbent material lining the perimeter of the

infrared absorption glass. Mechanisms such as the shutter and the mirror are manufac-

tured in ways that reduce the generation of dust. The LPF uses grounding and a conduc-

tion process to discharge static electricity, minimizing dust adherence. And, to prevent

the dust from entering the internal parts, the unit's outer periphery is sealed. The speci-

fications of the unit's operating condition, forced termination condition, and Dust Delete

Data acquisition and application are the same as with the EOS-1D Mark III.

Self Cleaning Sensor Unit Construction Diagram

Sealing material

Infrared-absorption

glass

As with the EOS-1D Mark III, 6 drive modes (single shooting, high-speed continuous,

low-speed continuous, 10-sec. self-timer, 2-sec. self-timer, and silent single shooting)

are provided. The noise level of the single shooting and silent single shooting modes is

the same as with the EOS-1D Mark III.

IV. DISCUSSION OF NEW AND IMPROVED FEATURES

Absorbent Material

CMOS sensor

Low-pass filter

Piezoelectric element

Support material