Baumer HUBNER BERLIN PROFI NET microGen HMG10P Istruzioni per il montaggio e il funzionamento - Pagina 7
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2.2
Attention instructions for mounting and operation
)
Risk of destruction due to electrostatic charge
Electronic parts contained in the device are sensitive to high voltages�
» Do not touch plug contacts or electronic components�
» Protect output terminals against external voltages�
» Do not exceed maximum voltage supply�
)
Risk of destruction due to mechanical overload
Rigid mounting may give rise to constraining forces�
» Never restrict the freedom of movement of the device� The mounting instructions
must be followed�
» It is essential that the specified clearances and/or angles are observed.
)
Risk of destruction due to mechanical shock
Violent shocks, e� g� due to hammer impacts, can lead to the destruction of the
sensing system�
» Never use force� Mounting is simple when correct procedure is followed�
» Use suitable puller for dismounting�
)
Risk of destruction due to contamination
Dirt penetrating inside the device can cause short circuits and damage the sensing
system�
» Absolute cleanliness must be maintained when carrying out any work on the
device�
» Never allow lubricants to penetrate the device�
)
Risk of destruction due to adhesive fluids
Adhesive fluids can damage the sensing system and the ball bearings. Dismounting
a device, secured to a shaft by adhesive may lead to the destruction of the device�
» Do not use adhesive fluids for fixing.
MB248EN - 11171699, 19A2, Baumer_HMG10-PROFINET_II_EN
SAFETy AND ATTENTION INSTRUCTIONS
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