Hi-Link HLK-7628D Manuale d'uso - Pagina 2

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Contents

1. PRODUCT DESCRIPTION.....................................................................................................................................1

1.1. BASIC PARAMETERS........................................................................................................................................ 1

1.2. MODULE PHYSICAL MAP................................................................................................................................ 2

2. BLOCK DIAGRAM.................................................................................................................................................2

2.1. TYPICAL APPLICATION.................................................................................................................................... 3

2.2. SPECIFICATION.................................................................................................................................................. 4

2.3. INTERFACE..........................................................................................................................................................4

3. ELECTRICAL CHARACTERISTICS..................................................................................................................... 5

3.1. POWER SUPPLY REQUIREMENTS.................................................................................................................. 5

3.2. RADIO FREQUENCY CHARACTERISTICS.....................................................................................................5

4. MODULE PIN DEFINITION.................................................................................................................................. 7

4.1. PIN DEFINITION DIAGRAM............................................................................................................................. 7

4.2. DEFAULT PIN FUNCTION (SERIAL PASSTHROUGH FIRMWARE).......................................................... 8

5. MODULE DIMENSION........................................................................................................................................ 11

6. REFLOW SOLDERING TEMPERATURE CURVE............................................................................................ 12