Dell E665 Manuale d'uso - Pagina 27

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Table 33. Particulate contamination specifications (continued)

Particulate contamination

Corrosive dust

Table 34. Gaseous contamination specifications

Gaseous contamination

Copper Coupon Corrosion rate

Silver Coupon Corrosion rate

NOTE:

Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 35. Thermal restriction matrix for processor and fans

Configuration

Processor TDP

120 W

155 W

180 W

200 W

225 W

240 W

NOTE:

For 10 x 2.5-inch drives (NVMe), maximum supported ambient temperature is 30°C.

Table 36. Label reference

Label

STD

Processor cTDP Max

150 W

180 W

200 W

240 W

Specifications

NOTE:

This condition applies to data center and non-data

center environments.

NOTE:

Common sources of conductive dust include

manufacturing processes, and zinc whiskers from the

plating on the bottom of raised floor tiles.

● Air must be free of corrosive dust.

● Residual dust present in the air must have a deliquescent

point less than 60% relative humidity.

NOTE:

This condition applies to data center and non-data

center environments.

Specifications

<300 Å/month per Class G1 as defined by ANSI/

ISA71.04-2013

<200 Å/month as defined by ANSI/ISA71.04-2013

8 x 2.5-inch

STD fan

STD heat sink

STD fan

STD heat sink

STD fan

HPR heat sink

STD fan

HPR heat sink

HPR fan

HPR heat sink

HPR fan

HPR heat sink

Description

Standard

10 x 2.5-inch drives

(NVMe)

HPR fan

STD heat sink

HPR fan

STD heat sink

HPR fan

HPR heat sink

HPR fan

HPR heat sink

HPR fan

HPR heat sink

HPR fan

HPR heat sink

Technical specifications