Epcos B57620C5103J062 Manuale - Pagina 6
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Stampa la paginaSMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
Mounting Instructions
1. Termination
2. Recommended geometry of solder pads
3. Requirements for Solderability
- Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Wetting of soldering areas ≥ 95%.
Pb-containing solder: Sn(60)Pb(40)
Bath temperature (°C): 215 ± 3
Dwell time (s): 3 ± 0.3
Pb-free solder: Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 245 ± 5
Dwell time (s): 3 ± 0.3
SEN NTC PD
Please read Cautions and warnings and
Important notes at the end of this document.
Ni-barrier termination (Ag/Ni/Sn)
Size
A
B
[mm]
[mm]
0805
1.3
B
A
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Diffusion barrier - nickel
C
D
[mm]
[mm]
1.2
1.0
3.4
C
B
A
D
B57620C5103*062
Inner electrode
Base layer - silver
Outer layer - tin
2009-01-12