Dinghua DH-5830 Manuale - Pagina 19

Sfoglia online o scarica il pdf Manuale per Pistola di saldatura Dinghua DH-5830. Dinghua DH-5830 20. Bga rework station

properly before welding, otherwise it will be damage the BGA chip or PCB board.

6. The machine surface needs to be clean at regular time, especially the infrared heating board.

Avoid the dirt stay on the board, because the dirt can lead to heat radiation unnormally, bad

welding quality and shorten the using time of infrared heating element.

If the heating element was burn out because of these, our company is not

responsible for free change!

Concluding remarks:

In the electric products line,especially the PC and electric production

field,component trend to

management,various capsulation technology spring up, and BGA/CSP is the main

trend.

In order to satisfy the growing need of BGA device circuit assembly,

manufacturers should choose safer, more convenient, more speedily assembly and

repair equipment craft.

microminiaturization、 multi Function and greening of