Cypress CY62167DV18 Scheda tecnica - Pagina 4

Sfoglia online o scarica il pdf Scheda tecnica per Hardware del computer Cypress CY62167DV18. Cypress CY62167DV18 12. Mobl 16-mbit (1m x 16) static ram

Stampa la pagina
Thermal Resistance
[7]
Parameter
Description
Θ
Thermal Resistance
JA
(Junction to Ambient)
Θ
Thermal Resistance
JC
(Junction to Case)
AC Test Loads and Waveforms
R1
V
CC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Parameters
R1
R2
R
TH
V
TH
Data Retention Characteristics
Parameter
Description
V
V
for Data Retention
DR
CC
I
Data Retention Current
CCDR
[7]
t
Chip Deselect to Data Retention Time
CDR
[8]
t
Operation Recovery Time
R
Data Retention Waveform
V
CC
or
CE
1
,
BHE
BLE
or
CE
2
Notes
8. Full device operation requires linear V
9. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and BLE.
Document #: 38-05326 Rev. *C
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
R2
Rise Time = 1 V/ns
Equivalent to:
THE VENIN EQUIVALENT
OUTPUT
1.8V
13500
10800
6000
0.80
(Over the Operating Range)
V
= 1.0V, CE
CC
V
> V
IN
CC
[9]
DATA RETENTION MODE
V
, min
CC
t
CDR
> 100 µs or stable at V
ramp from V
to V
CC
DR
CC(min)
CY62167DV18 MoBL
ALL INPUT PULSES
V
CC
90%
10%
GND
R
TH
V
Conditions
> V
– 0.2V, CE
< 0.2V,
1
CC
2
– 0.2V or V
< 0.2V
IN
> 1.0V
V
DR
> 100 µs.
CC(min)
VFBGA
Unit
°C/W
55
°C/W
16
90%
10%
Fall Time = 1 V/ns
Unit
Ω
Ω
Ω
V
[2]
Min
Typ
Max
Unit
1.0
1.95
µA
10
0
t
RC
V
, min
CC
t
R
Page 4 of 11
®
V
ns
ns
[+] Feedback