Cypress Semiconductor CY7C1332AV25 Scheda tecnica - Pagina 11

Sfoglia online o scarica il pdf Scheda tecnica per Hardware del computer Cypress Semiconductor CY7C1332AV25. Cypress Semiconductor CY7C1332AV25 19. Cypress 18-mbit (512k x 36/1mbit x 18) pipelined register-register late write specification sheet

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Scan Register Sizes
Register Name
Instruction
Bypass
ID
Boundary Scan
Instruction Codes
Instruction
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
Boundary Scan Order (1 Mbit x 18)
Bit #
Bump ID
1
5R
2
6T
3
4P
4
6R
5
5T
6
7T
7
7P
8
6N
9
6L
10
7K
11
5L
12
4L
13
4K
14
4F
15
6H
16
7G
17
6F
Document No: 001-07844 Rev. *A
PRELIMINARY
Bit Size—CY7C1330AV25
3
1
32
70
Code
000
Captures the Input/Output ring contents.
001
Loads the ID register with the vendor ID code and places the register between TDI
and TDO. This operation does not affect SRAM operation.
010
Captures the Input/Output contents. Places the boundary scan register between
TDI and TDO. Forces all SRAM output drivers to a High-Z state.
011
Do Not Use: This instruction is reserved for future use.
100
Captures the Input/Output ring contents. Places the boundary scan register
between TDI and TDO. Does not affect the SRAM operation.
101
Do Not Use: This instruction is reserved for future use.
110
Do Not Use: This instruction is reserved for future use.
111
Places the bypass register between TDI and TDO. This operation does not affect
SRAM operation.
Bit #
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Bit Size—CY7C1332AV25
Description
Bump ID
Bit #
7E
35
6D
36
6A
37
6C
38
5C
39
5A
40
6B
41
5B
42
3B
43
2B
44
3A
45
3C
46
2C
47
2A
48
1D
49
2E
50
2G
51
CY7C1330AV25
CY7C1332AV25
3
1
32
51
Bump ID
1H
3G
4D
4E
4G
4H
4M
2K
1L
2M
1N
2P
3T
2R
4N
2T
3R
Page 11 of 19
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