コンピュータ・ハードウェア AMD Turion 64 X2のPDF 製品データシートをオンラインで閲覧またはダウンロードできます。AMD Turion 64 X2 2 ページ。 Mobile technology dual-core processor
ページを印刷するAMD Turion™ 64 X2 Mobile
Technology Dual-Core Processor
Product Data Sheet
•
Compatible with Existing 32-Bit Code Base
–
Including support for SSE, SSE2, SSE3*, MMX™,
3DNow!™ technology, and legacy x86 instructions
*SSE3 supported by Rev. E and later processors
–
Runs existing operating systems and drivers
–
Local APIC on the chip
•
AMD64 Technology
–
AMD64 technology instruction set extensions
–
64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses
–
Eight additional 64-bit integer registers (16 total)
–
Eight additional 128-bit SSE registers (16 total)
•
Dual-Core Architecture
–
Discrete L1 and L2 cache structures for each core
•
Enhanced Virus Protection
–
No Execute (NX) bit in page-translation tables
specifies whether code can be executed from the
page
•
HyperTransport™ Technology to I/O Devices
–
One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gbytes/s in each direction
•
64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache
–
Two 64-bit operations per cycle, 3-cycle latency
•
64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache
–
With advanced branch prediction
•
16-Way Associative ECC-Protected
L2 Cache
–
Exclusive cache architecture—storage in addition
to L1 caches
–
Up to 1 Mbyte per L2 cache
–
1 Mbyte and 512-Kbyte options
•
Machine Check Architecture
–
Includes hardware scrubbing of major
ECC-protected arrays
Publication #
41407
Issue Date:
September 2006
Socket S1g1 Processor Specific
Features
•
Refer to the Socket S1g1 Processor Functional
Data Sheet, order# 31731, for functional and
mechanical details of socket S1g1 processors.
Refer to the AMD NPT Family 0Fh Processor
Electrical Data Sheet, order# 31119, for
electrical details of socket S1g1 processors.
•
Packaging
–
–
–
–
–
•
Integrated Memory Controller
–
–
–
•
Electrical Interfaces
–
–
–
•
Power Management
–
–
–
–
Revision:
3.02
Advanced Micro Devices
638-pin lidless micro PGA package
1.27-mm pin pitch
26 x 26 pin grid array
35 mm x 35 mm organic substrate
Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in specifically
exempted applications
Low-latency, high-bandwidth
128-bit DDR2 SDRAM controller operating at up
to 333 MHz
Supports up to two unbuffered SO-DIMMs
HyperTransport™ technology: LVDS-like
differential, unidirectional
DDR2 SDRAM: SSTL_1.8 per JEDEC
specification
Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications.
Multiple low-power states including Deeper Sleep
(C1E with AltVID)
System Management Mode (SMM)
ACPI compliant, including support for processor
performance states
AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.