ページを印刷するFMC150 User Manual
°
°
-40
C to +85
Storage temperature:
°
-40
C to +120
6.2 Monitoring
The AMC7823 device may be used to monitor the voltage on the different power rails as well
as the temperature. It is recommended that the carrier card and/or host software uses the
power-down features in the devices in the case the temperature is too high. Normal operations
can resume once the temperature is within the operating conditions boundaries.
6.3 Cooling
Two different types of cooling will be available for the FMC150.
6.3.1 Convection cooling
The air flow provided by the chassis fans the FMC150 is enclosed in will dissipate the heat
generated by the on board components. A minimum airflow of 300 LFM is recommended.
Optionally low profile FANs can be glued on top of the devices. Refer to section 5.5 on how to
control these FANs.
For standalone operations (such as on a Xilinx development kit), it is highly recommended to
blow air across the FMC and ensure that the temperature of the devices is within the allowed
range. 4DSP's warranty does not cover boards on which the maximum allowed temperature
has been exceeded.
6.3.2 Conduction cooling
In demanding environments, the ambient temperature inside a chassis could be close to the
operating temperature defined in this document. It is very likely that in these conditions the
junction temperature of power consuming devices will exceed the operating conditions
recommended by the devices manufacturers (mostly +85
coupled with sufficient air flow might be sufficient to maintain the temperature within operating
boundaries, some active cooling would yield better results and would certainly help with
resuming operations much faster in the case the devices were disabled because of a
temperature "over range".
7 Safety
This module presents no hazard to the user.
8 EMC
This module is designed to operate from within an enclosed host system, which is build to
provide EMC shielding. Operation within the EU EMC guidelines is not guaranteed unless it is
installed within an adequate host system. This module is protected from damage by fast
voltage transients originating from outside the host system which may be introduced through
the system.
January 2012
C (Industrial)
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C
FMC150 User Manual
www.4dsp.com
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C). While a low profile heat sink
r1.6
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