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4 Thermal and airflow considerations

Dell rack enclosures are designed for maximum airflow and the reduction of thermal issues, which

means greater efficiency and power savings for your data center.

The front and rear doors have 80% perforation to allow air to move through the rack with minimal

resistance, and flexible air dams help keep hot air from recirculating from the back to the front,

alleviating a problem common in many racks. Dell's wide rack enclosure employs extended air dams

across the front to ensure proper airflow containment. Available blanking panels can further manage

airflow by filling unused U- space in the rack; see the Rack kit accessories section for information on

thermal accessories.

For hot- aisle/cold- aisle thermally- efficient data center topologies, the standard rack enclosure fits

within two standard floor tiles, in a space approximately 2 feet wide x 3.5 feet deep. The 750mm

wide rack is slightly wider and the 1200mm deep rack is slightly deeper. Space planners can select

the form factor that best meets data center needs.

PowerEdge Rack Enclosures Technical Guide