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SMD NTC Thermistor with Ni-Barrier Termination
- Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Leaching of side edges ≤ 1/3.
Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 260 ± 5
Dwell time (s): 10 ± 1
4. Recommended soldering profiles
Reflow soldering profile: (according to CECC 00802)
Temperature characteristics at component terminals during reflow soldering
(two cycles are permitted).
Wave soldering profile:
Temperature characteristics at component terminals during wave soldering can be recommended once in
general.
SEN NTC PD
Please read Cautions and warnings and
Important notes at the end of this document.
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B57620C5103*062
2009-01-12