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スピーカーシステム Pioneer XW-HTP550のPDF サービスマニュアルをオンラインで閲覧またはダウンロードできます。Pioneer XW-HTP550 45 ページ。 Pioneer digital wireless speaker system
Pioneer XW-HTP550 にも： 取扱説明書 (28 ページ), サービスマニュアル (45 ページ)
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CONTENTS
SAFETY INFORMATION ..................................................................................................................................... 2
1. SPECIFICATIONS ............................................................................................................................................ 5
2. EXPLODED VIEWS AND PARTS LIST ............................................................................................................ 6
A
2.1 PACKING ................................................................................................................................................... 6
2.2 TRANSMITTER SECTION......................................................................................................................... 8
2.3 WIRELESS SPEAKER SECTION............................................................................................................ 10
3. BLOCK DIAGRAM and SCHEMATIC DIAGRAM ........................................................................................... 12
3.1 OVERALL BLOCK DIAGRAM.................................................................................................................. 12
3.2 OVERALL WIRING DIAGRAM................................................................................................................. 14
3.3 MAIN, LED, PRIMARY and BINDER ASSYS........................................................................................... 16
3.4 TX ASSY .................................................................................................................................................. 18
3.5 RX ASSY ................................................................................................................................................. 20
4. PCB CONNECTION DIAGRAM ..................................................................................................................... 22
4.1 MAIN and BINDER ASSYS ..................................................................................................................... 23
4.2 PRIMARY ASSY ...................................................................................................................................... 25
B
4.3 TX ASSY .................................................................................................................................................. 27
4.4 LED and RX ASSYS ................................................................................................................................ 29
5. PCB PARTS LIST ........................................................................................................................................... 31
6. ADJUSTMENT ............................................................................................................................................... 32
7. GENERAL INFORMATION ............................................................................................................................. 33
7.1 DIAGNOSIS ............................................................................................................................................. 33
7.1.1 DIAGNOSIS NOTE ............................................................................................................................... 33
7.1.2 TROUBLE SHOOTING ......................................................................................................................... 35
7.1.3 DIAGNOSIS OF TX and RX MODULES ............................................................................................... 38
7.1.4 DIAGNOSIS OF THE AMPLIFIER SECTION ....................................................................................... 39
7.1.5 PROTECTION CIRCUIT ....................................................................................................................... 40
C
7.1.6 DISASSEMBLY ..................................................................................................................................... 41
7.2 IC ............................................................................................................................................................. 43
8. PANEL FACILITIES ........................................................................................................................................ 45
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