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Power Supply Subsystem
The power supply subsystem of the PRIMEPOWER 650 is capable of handling 100-120 VAC or 200-240 V AC at
50/60 Hz. For 100 V AC, the power supply subsystem is connected using three cables as standard. For 200 V AC, the
power supply subsystem is connected using two cables as standard. The power supply subsystem of the
PRIMEPOWER 850 is capable of handling 200-240 V AC at 50/60 Hz. For the PRIMEPOWER 850, one AC cable is
used to connect the power supply subsystem as standard.
A power supply unit (FEP: Front End Power) is connected to the AC cables of each of the units. The FEP has been
shrunk by employing high-density mounting techniques. In addition, a compact, highly efficient DC-DC converter has
been developed as conversion unit for each load voltage. The compactness of this DC-DC converter contributes to the
reduced design footprint of the overall unit.
An N + 1 redundant configuration (option) is supported for the FEP of each unit. In this case, a system failure can be
avoided even if a FEP fails. Because the FEPs are also hot swappable, the system need not be stopped for maintenance.
A dual power feed option (option) is also supported. This option enables operation to continue using the other power
supply even if a power supply error or power supply failure occurs. Either of these two options can be accommodated in
the base cabinet.
A UPS is supported. By connecting a UPS, the system can be safely shut down when a power failure occurs and data
corruption can be prevented.
Cooling system
PRIMEPOWER 650 and 850 both employ the latest cooling technology. In particular these models feature highly
capable cooling systems that are compact and especially suitable for high-density mounting. A redundant configuration
is used for the cooling fans. High availability is assured through the use of compact, high-performance cooling fans that
as well as being extremely reliable are also hot swappable. Importantly the cooling capability of the fans is sufficient to
handle future processor enhancements. Plus through the use of rotation speed control, fan noise can be kept below 50 dB,
in most customer environments, while simultaneously providing suitable cooling performance even in high than average
temperature environments.
To increase cooling efficiency, the system board and power supply-I/O section are cooled separately. Two CPU modules
are mounted vertically in a row on the system board. Using the space under the first CPU module as a bypass passage,
cold air is blown in at high speed to effectively cool the inherently hard-to-cool second CPU module. In the power
supply-I/O section, special airflow control fins are used to achieve effective cooling.
CPU module
Bypass passage
01/12/31
PRIMEPOWER 650 and 850 Technical White Paper
CPU module
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