EPC EPC90147 빠른 시작 매뉴얼 - 페이지 12
{카테고리_이름} EPC EPC90147에 대한 빠른 시작 매뉴얼을 온라인으로 검색하거나 PDF를 다운로드하세요. EPC EPC90147 14 페이지.
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Figure 17: Measured thermal image showing the case temperature when operating under the following conditions:
Figure 18: Measured thermal image showing the case temperature when operating under the following conditions:
THERMAL DERATING
Using the thermal setup for the board, additional testing at 500 LFM and 1000 LFM was conducted to determine the ambient temperature derating
for the board with and without a heatsink attached. The temperature rise as function of load current is measured and the derating curves generated
for a maximum case temperature of 110°C and shown in figure 19 for various switching frequencies.
Thermal Derating Curves: 500 LFM
45
40
35
30
25
20
15
10
5
0
25
Figure 19: Typical thermal derating curve for two air flow rates, with and without a heatsink attached,
measured with the board operating at various switching frequencies and using a 2.2 µH inductor
For support files including schematic, Bill of Materials (BOM), and gerber files please visit the
EPC90147 landing page at:
EPC – POWER CONVERSION TECHNOLOGY LEADER |
PCB without heatsink
f
= 1 MHz, I
= 17 A output, 25°C ambient and high airflow
S
OUT
PCB without heatsink
f
= 1.5 MHz, I
S
OUT
1 MHz 500 LFM
1.5 MHz 500 LFM
500 kHz 500 LFM
35
45
55
65
75
85
Ambient Temperature (°C)
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= 13 A output, 25°C ambient and high airflow
Thermal Derating Curves: 1000 LFM
45
40
35
30
25
20
15
10
5
0
95
105
25
35
45
1 MHz 1000 LFM
1.5 MHz 1000 LFM
500 kHz 1000 LFM
55
65
75
85
95
Ambient Temperature (°C)
EPC90147
105
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