Epcos B57620C5103J062 매뉴얼 - 페이지 12

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SMD NTC Thermistor

SMD NTC Thermistor with Ni-Barrier Termination

Mounting

When NTC thermistors are encapsulated with sealing material or over molded with plastic material, there

must be no mechanical stress caused by thermal expansion during the production process (curing / over

molding process) and during later operation. The upper category temperature of the thermistor must not be

exceeded. Ensure that the materials used (sealing compound and plastic material) are chemically neutral.

Electrode must not be scratched before/during/after the mounting process.

Contacts and housing used for assembly with thermistor have to be clean before mounting.

Ensure that adjacent materials are designed for operation at temperatures comparable to the surface

temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature.

Avoid contamination of thermistor surface during processing.

Operation

Use thermistors only within the specified operating temperature range.

Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric

conditions.

Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no

water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the

specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids

(e.g. Galden).

Avoid dewing and condensation.

Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by

malfunction (e.g. use VDR for limitation of overvoltage condition).

SEN NTC PD

Please read Cautions and warnings and

Important notes at the end of this document.

Page 12 of 13

B57620C5103*062

2009-01-12