Toshiba 14AF45C, 20AF45C 서비스 매뉴얼 - 페이지 16

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Toshiba 14AF45C, 20AF45C에 대해서도 마찬가지입니다: 소유자 매뉴얼 (28 페이지)

페이지 인쇄

REMOVAL AND INSTALLATION OF

FLAT PACKAGE IC

REMOVAL

Put Masking Tape (cotton tape) around the Flat Package

IC to protect other parts from any damage.

(Refer to Fig. 2-1.)

NOTE

Masking is carried out on all the parts located within 10

mm distance from IC leads.

Masking Tape

(Cotton Tape)

Heat the IC leads using a blower type IC desoldering

machine. (Refer to Fig. 2-2.)

NOTE

Do not rotate or move the IC back and forth , until IC

can move back and forth easily after desoldering the

leads completely.

DISASSEMBLY INSTRUCTIONS

Fig. 2-1

Blower type IC

desoldering machine

Fig. 2-2

B2-1

When IC starts moving back and forth easily after

desoldering completely, pickup the corner of the IC using a

tweezers and remove the IC by moving with the IC

desoldering machine. (Refer to Fig. 2-3.)

NOTE

Some ICs on the PCB are affixed with glue, so be

careful not to break or damage the foil of each IC leads

or solder lands under the IC when removing it.

Tweezers

Peel off the Masking Tape.

Absorb the solder left on the pattern using the Braided

Shield Wire. (Refer to Fig. 2-4.)

NOTE

Do not move the Braided Shield Wire in the vertical

direction towards the IC pattern.

Braided Shield Wire

Blower type IC

desoldering

machine

Fig. 2-3

Soldering Iron

IC pattern

Fig. 2-4

14AF45/14AF45C