Toshiba 20AS25 서비스 매뉴얼 - 페이지 11

{카테고리_이름} Toshiba 20AS25에 대한 서비스 매뉴얼을 온라인으로 검색하거나 PDF를 다운로드하세요. Toshiba 20AS25 33 페이지. 20as25 user's guide
Toshiba 20AS25에 대해서도 마찬가지입니다: 소유자 매뉴얼 (15 페이지)

페이지 인쇄

REMOVAL AND INSTALLATION OF

FLAT PACKAGE IC

REMOVAL

Put the Masking Tape (cotton tape) around the Flat

Package IC to protect other parts from any damage.

(Refer to Fig. 2-1.)

NOTE

Masking is carried out on all the parts located within 10

mm distance from IC leads.

Masking Tape

(Cotton Tape)

Heat the IC leads using a blower type IC desoldering

machine. (Refer to Fig. 2-2.)

NOTE

Do not add the rotating and the back and forth

directions force on the IC, until IC can move back and

forth easily after desoldering the IC leads completely.

DISASSEMBLY INSTRUCTIONS

Fig. 2-1

Blower type IC

desoldering machine

Fig. 2-2

B2-1

When IC starts moving back and forth easily after

desoldering completely, pickup the corner of the IC using a

tweezers and remove the IC by moving with the IC

desoldering machine. (Refer to Fig. 2-3.)

NOTE

Some ICs on the PCB are affixed with glue, so be

careful not to break or damage the foil of each IC leads

or solder lands under the IC when removing it.

Tweezers

Peel off the Masking Tape.

Absorb the solder left on the pattern using the Braided

Shield Wire. (Refer to Fig. 2-4.)

NOTE

Do not move the Braided Shield Wire in the vertical

direction towards the IC pattern.

Braided Shield Wire

Blower type IC

desoldering

machine

Fig. 2-3

Soldering Iron

IC pattern

Fig. 2-4