CEL MeshConnect ZICM0900P2-KIT1-1 Preliminary Data Sheet - Page 12

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PROCESSING

Recommended Reflow Profile

Parameters Values

Ramp up rate (from Tsoakmax to Tpeak)

Minimum Soak Temperature

Maximum Soak Temperature

Soak Time

TLiquidus

Time above TL

Tpeak

Time within 5º of Tpeak

Time from 25º to Tpeak

Ramp down rate

Achieve the brightest possible solder fillets with a good shape and low contact angle.

Pb-Free Soldering Paste

Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process.

Note:

The quality of solder joints on the castellations ('half vias') where they contact the host board should meet the appropriate IPC

fication. See the latest IPC-A-610 "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations."

Cleaning

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed

with any cleaning process.

• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and

the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between

neighboring pads. Water could also damage any stickers or labels.

• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which

is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.

• Ultrasonic cleaning could damage the module permanently.

The best approach is to consider using a "no clean" soldering paste and eliminate the post-soldering cleaning step.

Optical Inspection

After soldering the Module to the host board, consider optical inspection to check the following:

• Proper alignment and centering of the module over the pads.

• Proper solder joints on all pads.

• Excessive solder or contacts to neighboring pads, or vias.

Repeating Reflow Soldering

Only a single reflow soldering process is encouraged for host boards.

Wave Soldering

If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave

soldering process is encouraged.

MeshConnect™ Sub-G Module Series

3º/sec max

150ºC

200ºC

60-120 sec

217ºC

60-150 sec

250ºC

20-30 sec

8 min max

6ºC/sec max

Speci-

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