Fujitsu D1451 Technical Manual - Page 26

Browse online or download pdf Technical Manual for Motherboard Fujitsu D1451. Fujitsu D1451 42 pages. Siemens

Print Page

Installing and removing processors

Mounting heat sink

Be sure to use heat conducting material between the processor and the heat sink. If a heat

conducting pad (rubber-like foil) is already applied to the heat sink, then use it. Otherwise you must

apply a very thin layer of heat conducting paste.

Heat conducting pads can only be used once. If you remove the heat sink, you must clean it and

apply new heat conducting paste before you remount it.

Please note that, depending on the heat sink used, different heat sink mounts are required on the

mainboard.

If a counter-plate is mounted on the underside of the mainboard for reinforcement, no

heat sinks of the type "Intel Boxed" may be used. Otherwise the retaining clips of the heat

sink will be damaged.

When using an "Intel Boxed" heat sink, the mainboard must be converted. This

conversion set is either included with the mainboard or is available separately.

If no counter-plate is mounted, you can use both "Intel Boxed" heat sinks and standard

heat sinks. If you use the "Intel Boxed" heat sink, the mainboard will bend due to the high

pressure of the retaining clips. This behaviour is specified by Intel.

16 - English

Depending on the configuration variant, you

must pull a protective foil off the heat sink or

coat the heat sink with heat conducting paste

before fitting it.

Depending on the processor variant, clips

may also be supplied for mounting the heat

sink that fix it in place.

When you have mounted the optional fan,

connect the fan plug to the corresponding

connection on the mainboard.

A26361-D1451-Z120-1-6319