Dell EMC PowerEdge XE8545 Technical Specifications - Page 15
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Table 18. Shared requirements across all categories
Temperature
Allowable continuous operations
Maximum temperature gradient (applies to both
operation and non-operation)
Non-operational temperature limits
Non-operational humidity limits
Maximum non-operational altitude
Maximum operational altitude
Table 19. Maximum vibration specifications
Maximum vibration
Operating
Storage
Table 20. Maximum shock pulse specifications
Maximum shock pulse
Operating
Storage
Thermal restriction matrix
Table 21. Thermal restriction matrix
TDP (W)
Heat sink type
AMD Milan 64C
280W 2.5-2.6
GHz 256 MB
AMD Milan 24C
240W 3.15 GHz
256 MB
AMD Milan 64C
225W 2.05-2.15
GHz 256 MB
2U CPU Heat
AMD Milan 32C
225W 2.7-2.8
GHz 256 MB
AMD Milan 64C
225W 2.0 GHz
256 MB
AMD Milan 48C
225W 2.2-2.3
GHz 256 MB
Fan Type
-
Very High
Performance
sink
Fan
Specifications
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15
minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:
* - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.
-40 to 65°C (-104 to 149°F)
5% to 95% RH with 27°C (80.6°F) maximum dew point
12,000 meters (39,370 feet)
3,048 meters (10,000 feet)
Specifications
0.21 G
at 5 Hz to 500 Hz (all operation orientations)
rms
1.88 G
at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
rms
Specifications
Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
2 x 2.5" SAS + 8 x 2.5" NVMe
ASHRAE A2
Ambient Limit
(Max 35° C)
(Max 30° C)
Ambient Limit
(Max 25° C)
Supported
Technical specifications
Ambient Limit
(Max 20° C)
15