Dell OptiPlex FX170 Technical Manualbook - Page 5
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DELL™ OPTIPLEX™ FX170 TECHNICAL GUIDEBOOK 1.0
DETAILED ENGINEERING SPECIFICATIONS
SYST EM COM PO N ENT S D E TAI L S:
Processor
Memory
Data Storage
Storage
Display
Audio
I/O Physical
Networking
Environment
Power
Mounting
Security
Physical
Characteristics
CPU / Chipsets
RAM
DOM
Resolution
Video Memory
Display Data Control
Speaker
Front
USB (1.1/2.0)
Rear
PS/2
Video
DVI
Mic-In
Audio
Line-Out
LAN
WLAN
Operation
Temperature
Storage
Relative Humidity
Power Supply
Horizontal or Vertical
Foot Stand
VESA Bracket (wall mount vertical only)
Kensington Lock
Chassis Housing
Thin Client
Dimension /
Packing : Single Box
Weight
Packing : Carton
Intel Atom N270 1.6 GHz / Intel 945GSE + ICH7-M
1GB DDR2 RAM (WES 2009/DeTOS),
2GB DDR2 RAM (WES7)
2GB DOM (WES 2009), 4GB DOM (WES7),
1GB DOM (DeTOS)
x 1 (44 pins IDE port for DOM)
Up to 1920x1200 at 32 bit color
Dynamic Video Memory Technology (DVMT) 3.0 sup-
ports up to 224MB of video memory
On-board Intel GMA 950
x 1 (Built-in 1W internal speaker)
x 2
x 2
x 1 (For keyboard, mouse or optional PS/2 splitter cable)
x 1 DVI-I (or x 1 VGA with included adapter)
x 1 3.5 mm jack
x 1 3.5 mm jack
x 1 (RJ-45, 10/100/1000 Base-T)
Optional (Linksys WUSB600N USB Network Adapter, sold
separately)
32° to 95° F (0° to 35° C)
-4° to 140° F (-20° to 60° C)
20% to 80% non-condensing
36W, DC 12V/3A external power adapter
Vertical
Metal mounting kit for VESA standard (Option)
Yes
Plastic and metal
36 (W) x 156 (H) x 122 (D) mm / NW : 0.75 KG
217 (W) x 85 (H) x 236 (D) mm / GW : 1.65 KG
450 (W) x 265 (H) x 355 (D) mm / GW : 20 KG, 8 boxes in
one carton
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