Dell PowerEdge M910 Technical Manual - Page 3
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Table of Contents
1 Product comparison .......................................................................................................................................................... 6
Powerful performance ...................................................................................................................................................... 6
Scaling capability ............................................................................................................................................................... 6
High reliability ..................................................................................................................................................................... 6
Product comparison .......................................................................................................................................................... 7
2 Key technologies ................................................................................................................................................................ 9
Intel 7510 chipset ............................................................................................................................................................... 9
Intel processors .................................................................................................................................................................. 9
FlexMem Bridge .......................................................................................................................................................... 10
I/O Hub (IOH) with Intel QuickPath Architecture ................................................................................................. 10
DDR3 memory ............................................................................................................................................................ 10
PCIe 2.0 ........................................................................................................................................................................ 10
Internal redundant SD module ................................................................................................................................. 10
iDRAC6 Express ........................................................................................................................................................... 10
3 System information ........................................................................................................................................................... 11
Product features summary ............................................................................................................................................. 11
4 Mechanical ......................................................................................................................................................................... 13
Module dimensions and weight ..................................................................................................................................... 13
Internal module ................................................................................................................................................................. 13
Security ...............................................................................................................................................................................14
Cover latch.........................................................................................................................................................................14
TPM (Trusted Platform Module) .....................................................................................................................................14
Power off security............................................................................................................................................................. 15
USB key ............................................................................................................................................................................... 15
Battery ................................................................................................................................................................................. 15
Field replaceable units (FRU) .......................................................................................................................................... 15
5 Power, thermal and acoustics ........................................................................................................................................ 16
Acoustics ............................................................................................................................................................................ 17
Definitions: .................................................................................................................................................................... 17
Thermal ..............................................................................................................................................................................18
Power efficiency ...............................................................................................................................................................18
6 Processors .......................................................................................................................................................................... 19
Features .............................................................................................................................................................................. 19
Supported processors ..................................................................................................................................................... 20
Processor configurations ................................................................................................................................................ 21
FlexMem Bridge ................................................................................................................................................................ 21
7 Memory .............................................................................................................................................................................. 23
DIMMs supported ............................................................................................................................................................ 23
DIMM slots ........................................................................................................................................................................ 23
Intel 7500 SMB ................................................................................................................................................................. 23
Memory RAS support ...................................................................................................................................................... 24
Sparing .......................................................................................................................................................................... 24
Mirroring ....................................................................................................................................................................... 24
Supported memory configurations .............................................................................................................................. 24
8 Chipset ............................................................................................................................................................................... 25
Intel 7500 I/O Hub (IOH) ................................................................................................................................................ 25
IOH QuickPath Interconnect (QPI) .............................................................................................................................. 25
PCIe 2.0 ............................................................................................................................................................................. 25
Direct Media Interface .................................................................................................................................................... 25
Intel I/O Controller Hub 10 ............................................................................................................................................ 25
PCIe mezzanine connectors ......................................................................................................................................... 26
PowerEdge M910 Technical Guide
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