HP 226824-001 - ProLiant - ML750 Overview

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Also for HP 226824-001 - ProLiant - ML750: Frequently Asked Questions (4 pages), Implementation Manual (35 pages), Technical White Paper (12 pages), Firmware Update (9 pages), Implementation Manual (26 pages), Introduction Manual (22 pages), Troubleshooting Manual (18 pages), Implementation Manual (11 pages), Installation Manual (2 pages), Configuration Manual (2 pages), Introduction Manual (19 pages), Update Manual (9 pages), Update Manual (16 pages), Introduction Manual (12 pages), Introduction Manual (10 pages), Technology Brief (9 pages)

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HP 226824-001 - ProLiant - ML750 Overview
Memory technology evolution: an overview
of system memory technologies
technology brief, 8
th
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
Basic DRAM operation ......................................................................................................................... 2
DRAM storage density and power consumption ................................................................................... 4
Memory access time......................................................................................................................... 4
Chipsets and system bus timing.......................................................................................................... 4
Memory bus speed........................................................................................................................... 5
Burst mode access............................................................................................................................ 5
SDRAM technology .............................................................................................................................. 6
Bank interleaving ............................................................................................................................. 7
Increased bandwidth ........................................................................................................................ 7
Registered SDRAM modules .............................................................................................................. 7
DIMM Configurations ....................................................................................................................... 8
Memory channel interleaving .......................................................................................................... 10
Advanced memory technologies .......................................................................................................... 11
Double Data Rate SDRAM technologies ............................................................................................ 11
Fully-Buffered DIMMs...................................................................................................................... 15
Rambus DRAM .............................................................................................................................. 18
Importance of using HP-certified memory modules in ProLiant servers ....................................................... 19
Conclusion........................................................................................................................................ 19
For more information.......................................................................................................................... 20
Call to action .................................................................................................................................... 20
edition
Single-sided and double-sided DIMMs ............................................................................................ 8
Single-rank, dual-rank, and quad-rank DIMMs ................................................................................. 8
Rank interleaving.......................................................................................................................... 9
DDR-1 ....................................................................................................................................... 11
DDR-2 ....................................................................................................................................... 13
DDR-3 ....................................................................................................................................... 14
Module naming convention and peak bandwidth ........................................................................... 14
FB-DIMM architecture.................................................................................................................. 16
Challenges ................................................................................................................................ 17