HP Xw460c - ProLiant - Blade Workstation Management Manual - Page 9

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action to maintain the enclosure's ability to operate, including adjusting fan speed, reducing power

consumption, or performing shutdowns on some or all subsystems. The Fan Zones tab on the OA

Thermal Subsystem page (Figure 8) gives a real-time, single-screen, zone-by-zone view of the thermal

operating conditions.

Figure 8. Onboard Administrator Thermal Subsystem page via a web GUI

Power logic management

The Onboard Administrator manages component power allocation and can limit the overall power

consumption of the enclosure. This feature is often referred to as power capping. Power measurement

sensors are used to accurately monitor how much power is being consumed and how much power is

available. Onboard Administrator manages power using real-time measured power data instead of

maximum power envelopes. Therefore, customers can deploy more servers and interconnect modules

than if the configuration was based only on nameplate power specifications for each component.

Note

If redundancy mode is either AC Redundant or Power Supply

Redundant and power redundancy is lost, any additional power

requests from the Onboard Administrator will not be accepted,

even if there is enough non-redundant power available. For

example, newly inserted server blades will not be allowed to

power on. Either the failure must be corrected or the redundancy

mode must be changed.