HP Xw460c - ProLiant - Blade Workstation Overview - Page 20

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Figure 12. HP BladeSystem c7000 interconnect bay crosslinks as indicated by the arrows

HP Thermal Logic technologies

The HP BladeSystem c7000 Enclosure incorporates a variety of HP Thermal Logic technologies,

including mechanical design, built-in power and thermal monitoring, and control capabilities. Thermal

Logic technologies can provide significant power and cooling savings compared to traditional rack

and tower based servers.

temperature at the server, enclosure, or rack level. They automatically adjust power and thermal

controls to minimize power and cooling use while maintaining adequate cooling for all devices and

ensuring high availability.

HP Thermal Logic technologies include the following elements and capabilities:

Parallel Redundant Scalable Enclosure Cooling (PARSEC) design

Instant power and thermal monitoring

Pooled power for a variety of power redundancy modes

Dynamic Power Saver mode

Power Regulator

Dynamic Power Capping

Active Cool 200 fans

Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide

localized cooling in the specific areas needed by the server blade. Because such fans generate fairly

low airflow (in cubic feet per minute, or CFM) at medium back pressure, a single server often requires

multiple fans to ensure adequate cooling. If each server blade contains several fans, installing many

server blades together in an enclosure can result in a significant cost and space overhead.

A second solution for cooling is to use larger, blower-style fans that can provide cooling across an

entire enclosure. Such fans generate high airflow, but they typically require higher power input and

more space. They are loud and must be designed for the maximum load in an enclosure. As a result,

designers may have to sacrifice server features to allow large, high-power fans to fit in the enclosure.

Even then, ensuring adequate airflow to all the servers without leakage, over provisioning, or bypass

is a challenge.

For more information see the IDC technical brief titled ―Next-Generation Power and Cooling for Blade

Environments‖:

http://h20195.www2.hp.com/v2/GetPDF.aspx/4AA2-5177ENW.pdf

Thermal Logic technologies also provide an instant view of power use and