Cypress Semiconductor Nine-Output 3.3V Buffer CY2309NZ Manual - Page 4

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Test Circuits

Ordering Information

Ordering Code
[4]
CY2309NZSC–1H
[4]
CY2309NZSC–1HT
Pb-free
CY2309NZSXC–1H
CY2309NZSXC–1HT
CY2309NZSXI-1H
CY2309NZSXI-1HT

Package Diagram

16 Lead (150 Mil) SOIC
8
9
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.0138[0.350]
0.0192[0.487]
Note
4. Not recommended for new designs.
Document #: 38-07182 Rev. *E
V
DD
0.1 μF
OUTPUTS
V
DD
0.1 μF
GND
Package Type
16-pin 150-mil SOIC
16-pin 150-mil SOIC – Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC – Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC – Tape and Reel
Figure 6. 16-Pin (150-Mil) SOIC S16
PIN 1 ID
1
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
16
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0.0098[0.249]
CLK out
C
LOAD
GND
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
SEATING PLANE
0.016[0.406]
0°~8°
0.035[0.889]
CY2309NZ
Operating Range
Commercial
Commercial
Commercial
Commercial
Industrial
Industrial
MAX.
0.010[0.254]
X 45°
0.016[0.406]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
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